MTS HBM Product Engineering
Job Summary
As a key leader within the High Bandwidth Memory (HBM) Product Engineering team, you will spearhead a high-performing team driving manufacturing and quality activities for Micron’s latest HBM products. You will oversee the portfolio's KPIs including Quality, Cost, Cycle Time, and Scale, while collaborating with cross-functional teams to drive strategic technological objectives. This role requires technical expertise in circuit debug, test coverage optimization, and innovation in design-for-test (DFT) strategies.
Responsibilities
- Lead HBM product engineering and manufacturing activities
- Optimize test coverage and improve device yields
- Perform in-depth circuit debug and design validation
- Manage cross-functional collaboration and project roadmaps
- Mentor and develop high-performing engineering teams
Required Skills
- 8+ years semiconductor/product engineering experience
- Expertise in circuit analysis and CAD/Verilog
- Strong background in statistics and data analysis
- Proven leadership and project management skills
- Excellent communication and cross-functional collaboration
Job Details
Responsibilities:
- Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness in high-volume manufacturing.
- Product Development and Validation: Develop, validate, characterize, and qualify next-generation HBM products to ensure reliability and market readiness.
- New Product Design Support: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations.
- Yield Improvement and Cost Reduction: Improve manufacturing test yields related to DRAM, Interface, and Stacked Die, while reducing test time and resolving yield-related issues.
- Root Cause Analysis: Conduct root cause investigation and resolution for manufacturing test flow, qualification, and RMA device issues.
- Innovation: Promote innovation and drive technical changes to maintain a competitive advantage.
- Leadership: Mentor and develop team members, manage projects, and make critical decisions regarding risk analysis and prioritization.
- Cross-Functional Collaboration: Work closely with Fab, HBM Technology Development, Design, System Development, and Quality/Reliability teams.
Requirements:
- Bachelor's/Master's degree in Electrical and Electronics Engineering with 8+ years of semiconductor industry experience (Product Engineering experience preferred).
- Strong leadership and technical problem-solving skills, specifically in in-depth circuit analysis.
- Proficiency in statistics, data analysis tools, and scripting.
- Highly motivated with a flexible approach to dynamic working environments.
- Proven track record of cross-functional collaboration and project management.
- Excellent communication and presentation skills.
- Passion for people leadership and ongoing professional development.
- Ability to work on-site in Singapore with international travel opportunities to US, Taiwan, and Japan.