Microelectronic Assembly Engineer
Job Summary
The Microelectronic Assembly Engineer acts as a subject matter expert for the assembly team, providing guidance during new product development. The role involves operating and supervising equipment, including die attachment and wire bonding processes. Additionally, the engineer is responsible for developing, testing, and qualifying packaging solutions to ensure they meet design and manufacturing requirements.
Responsibilities
- Advise Design Engineering on manufacturability
- Operate and supervise assembly equipment
- Develop and qualify packaging solutions
- Establish stable assembly processes and documentation
Required Skills
- Degree/Diploma in Electronic/Mechatronic engineering
- 5-7 years microelectronics assembly experience
- Knowledge of die attachment and wire bonding
- Experience in engineering manufacturing environments
Job Details
The Job:
- Be the subject matter expert of microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable.
- Operate and supervise, including setup, die attachment and wire bonding equipment for all microelectronics assembly processes.
- Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for customer products in aerospace and defense applications.
- Responsible to define, develop and qualify new packages such as leadframe/substrate layout, bonding diagram, package outline drawing.
- Develop assembly processes and establish process documentation that are stable, repeatable, and reliably meet design requirements.
The Requirements:
- Degree/Diploma in electronic/mechatronic or any other engineering equivalent.
- Min 5-7 years of related microelectronics assembly experience.
- Preferably in an engineering manufacturing environment where all processes were utilized.