MTS Product System Engineer

Date PostedMay 6, 2026LocationSingaporeCompanyMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Salary$8,000 to $13,000 MonthlyTypeFull Time

Job Summary

As a Member of Technical Staff in the HBM Product Engineering team, you will lead a high-performing team focused on manufacturing, quality, and yield optimization for next-generation HBM products. You will spearhead test coverage strategies, circuit debug, and cross-functional collaboration to ensure product reliability and cost-efficiency. This role requires an experienced leader capable of driving technical innovation while mentoring a dynamic engineering team.

Responsibilities

  • Lead HBM product manufacturing and quality strategy
  • Optimize test coverage and improve device yields
  • Drive circuit debug and design verification
  • Mentor team members and manage technical projects
  • Collaborate with cross-functional global teams

Required Skills

  • 8+ years semiconductor experience
  • Electrical/Electronics Engineering degree
  • Advanced circuit analysis
  • Statistical and data analysis tools
  • Strong technical leadership

Job Details

Responsibilities: - Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain high-volume manufacturing effectiveness. - Product Development and Validation: Lead the development, validation, characterization, and qualification of next-generation HBM products to ensure reliability and market readiness. - Support for New Product Design Validation: Provide support for design verification and in-depth circuit debug of new products using CAD tools and Verilog simulations. - Yield Improvement and Cost Reduction: Improve manufacturing test yields related to DRAM, Interface, and Stacked Die, reduce test time, and resolve yield-related issues. - Root Cause Analysis: Conduct root cause analysis and resolution for manufacturing test flow issues, qualification, and RMA device issues. - Innovation: Promote innovation and drive technical changes to maintain a competitive advantage. - Mentorship: Actively develop and mentor team members to foster organizational growth. - Project Management: Ensure efficient execution of projects and timely delivery of technological solutions. - Technical Decision Making: Make decisions on risk analysis and project prioritization. - Cross-Functional Collaboration: Work with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams. Requirements: - Bachelors/Masters in Electrical and Electronics Engineering with 8+ years of experience in the semiconductor industry (Product Engineering experience preferred). - Strong leadership and technical problem-solving skills, with expertise in circuit analysis. - Proficiency in statistics, data analysis tools, and scripting. - Dedicated, highly motivated, and adaptable to a dynamic working environment. - Proven track record of collaborative work across diverse teams. - Strong sense of responsibility, accountability, and professional work ethic. - Excellent communication and presentation skills. - Passionate about people leadership and ongoing learning.