Principal Engineer R&D

Key Job Accountabilities: • Develop and implement technology roadmaps for processes, materials, equipment, and manufacturing platforms to support current and future product requirements. • Establish and qualify new process capabilities, equipment platforms, tooling solutions, and materials to support advanced packaging and next-generation manufacturing technologies. • Lead technology evaluation, benchmarking, and capability assessments of materials, equipment, tooling, and manufacturing solutions in collaboration with suppliers, customers, and internal stakeholders. • Define and maintain systematic approaches for material selection, process development, equipment qualification, and technology deployment. • Drive new equipment introduction, factory implementation, commissioning, and capability qualification for R&D and New Product Introduction (NPI) programs. • Assess process, equipment, and material readiness to support new technology and product development requirements. • Conduct technical feasibility studies, risk assessments, and gap analyses to identify capability requirements and development opportunities. • Collaborate closely with Business Units, Product Development, Process Engineering, Manufacturing, and external partners to align technology strategies with business and customer needs. • Lead cross-functional technology development projects from concept through qualification and production readiness. • Utilize statistical methods, design of experiments (DOE), and data-driven approaches to evaluate and optimize process and equipment performance. • Establish best practices, standards, and governance for technology platform development and deployment. • Support technology transfer activities and ensure successful integration of new capabilities into manufacturing operations. • Monitor industry trends and emerging technologies to identify opportunities for innovation and competitive advantage. Required Experience and Qualifications: • Bachelor's Degree or above in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline. • Minimum 10 years of relevant experience in semiconductor, advanced manufacturing, electronics packaging, or related industries, with strong exposure to process and equipment engineering. • Strong knowledge of advanced packaging technologies, wafer-level processes, heterogeneous integration, assembly processes, and manufacturing technologies. • Experience in technology development, equipment qualification, capability assessment, and process optimization. • Working knowledge of Design of Experiments (DOE), Statistical Process Control (SPC), Lean Six Sigma, DMAIC, and statistical analysis tools such as JMP or equivalent. • Proven experience in leading new technology implementation and equipment deployment projects in manufacturing environments. • Strong project leadership and stakeholder management skills, with the ability to influence across functions, organizations, and cultures. • Excellent analytical, troubleshooting, and problem-solving capabilities. • Strong communication, presentation, technical writing, and interpersonal skills. • Experience engaging with customers, suppliers, technology partners, and cross-functional teams. • Self-driven and capable of working independently in a fast-paced, dynamic environment with minimal supervision.