Principal Engineer PD Diffusion

Date PostedJune 15, 2026LocationSingaporeCompanyMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Salary$9,000 to $18,000 MonthlyTypeFull Time

Job Summary

As an Engineering lead, you will be responsible for starting up, developing, and optimizing processes to improve product quality, reliability, and yield. You will lead a team to drive manufacturing performance, cost reduction, and productivity while ensuring alignment with strategic business objectives. The role requires cross-functional collaboration with Technology Development, Manufacturing Engineering, and global sites to achieve world-class manufacturing results.

Responsibilities

  • Lead team to optimize process yield, quality, and reliability
  • Manage TD business processes and cost targets
  • Drive fab optimization and maximize production output
  • Mentor and develop engineering staff
  • Collaborate across global manufacturing sites

Required Skills

  • Semiconductor R&D or high-volume manufacturing leadership
  • Films deposition & Ion implant expertise
  • NAND cell device physics knowledge
  • Structured problem-solving
  • Strategic team management

Job Details

Responsibilities: - Lead a team to start up, develop, and optimize processes to improve product quality and reliability. - Focus on process yield, cell improvement, cost reduction, productivity improvement, and risk management. - Resolve manufacturing line problems and manage TD business processes (e.g., MOR POR gaps, cost targets). - Leverage global internal and external resources to define and enable equipment, yield, and output performance. - Build a strong team of engineers and collaborate with the Manufacturing Engineering team to hire and train staff. - Partner on KPIs to deliver on commitments and support effective collaboration across all geographies. - Complete required safety training and ensure work adheres to safety policies. - Develop strategic vision for the team and prioritize resources. - Achieve yield/cell/cost/MOR-POR gap targets for respective nodes. - Set performance targets and ensure line-of-sight goals are communicated. - Drive fab optimization, maximize output and yield while reducing operation costs. - Support business processes for new tool installations, modifications, relocations, and removals. - Identify and implement global best-known methods with 300mm counterparts. - Address large audiences, executives, and technology authorities on complex topics. - Partner with the People organization and ensure succession plans for key positions. Job Requirements: - Bachelor's/Masters in Electrical, Materials Science, Physics, Microelectronics, Chemical Engineering with at least 5 years of experience leading a Process Development team in semiconductor R&D or high-volume manufacturing. - OR PhD in the above fields with at least 3 years of experience leading a Process Development team. - Comprehensive understanding of films deposition, ion implant, and NAND cell device physics. - Knowledge and experience in high aspect ratio deposition and implant process development. - Demonstration of collaborative problem-solving and relationship building skills. - Demonstrated structured problem-solving capabilities. - Strong communication and interpersonal skills (written, verbal, and presentation). - Experience in mentoring and managing the performance of direct reports. - Ability to seek opportunities for continuous improvement.