Senior Staff Engineer HBM

Date PostedAugust 18, 2026LocationSingaporeCompanyMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Salary$6,000 to $9,900 MonthlyTypeFull Time

Job Summary

As a key leader within the High Bandwidth Memory (HBM) Product Engineering team, you will spearhead and develop a high-performing team driving reliability test development and execution. You will be responsible for driving extrinsic DPM reduction, leading the intrinsic reliability charter, and optimizing manufacturing test flows. Additionally, you will collaborate across functions to ensure quality, cost, and cycle time KPIs are met for Micron’s latest HBM products.

Responsibilities

  • Develop and execute reliability test flows and plans
  • Drive extrinsic and intrinsic DPM reduction
  • Lead root cause analysis and resolution for qual and RMA failures
  • Manage frontend process conversions and HVM for yield and cost optimization
  • Mentor team members and drive cross-functional collaboration

Required Skills

  • Bachelors or Masters in Electrical and Electronics Engineering
  • Strong leadership and technical problem-solving skills
  • Experience in circuit analysis, statistics, and data analysis tools
  • Excellent communication and cross-functional collaboration abilities
  • Product engineering experience preferred

Job Details

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Responsibilities: - Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. - Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. - DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time - Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. - Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. - Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. - Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. - Mentorship and Development of Others: The role involves actively developing and mentoring others. - Project Management: Developing project management skills within the team ensures efficient execution of projects. - Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. - Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Requirements: - Bachelors/Masters in Electrical and Electronics Engineering Degree or related field. Product Engineering experience is preferred. - Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis. - Good knowledge of statistics and data analysis tools and scripting. - Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment. - Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. - Strong sense of responsibility and accountability towards assigned role with professional work ethic. - Excellent communication and presentation skills. - Passionate about people leadership, with a drive toward ongoing learning and development in this area. - Work on site in Singapore with international travel to US, Taiwan and Japan.