HBM Product System Engineer
Job Summary
As a key technical contributor within the HBM Product Engineering team, you will drive manufacturing execution for next-generation HBM products. The role focuses on product enablement, manufacturing KPIs (Quality, Cost, Cycle Time), and cross-functional collaboration to ensure technical leadership. You will lead test flow development, yield improvement, and innovative test strategies to enhance efficiency.
Responsibilities
- Drive HBM manufacturing execution and KPIs
- Lead product validation and test flow development
- Conduct yield improvement and root cause analysis
- Collaborate with cross-functional engineering teams
Required Skills
- Electrical/Electronics Engineering degree
- Knowledge of DRAM and CMOS technology
- Python or JMP scripting/data analysis
- Strong problem-solving and communication skills
Job Details
Responsibilities:
- Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain high-volume manufacturing effectiveness.
- Product Development and Validation: Lead the development, validation, characterization, and qualification of next-generation HBM products to ensure market readiness.
- New Product Design Support: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations.
- Yield Improvement and Cost Reduction: Improve manufacturing test yields related to DRAM, interface, and stacked die, reduce test time, and resolve yield-related issues.
- Root Cause Analysis: Conduct root cause analysis and resolution for manufacturing test flow, qualification, and RMA device issues.
- Innovation: Promote innovation and drive technical changes to maintain a competitive advantage.
- Mentorship: Actively develop and mentor team members.
- Project Management: Manage projects to ensure timely delivery of technological solutions.
- Technical Decision Making: Lead risk analysis and project prioritization.
- Cross-Functional Collaboration: Work with Fab, HBM Technology Development, Design, System Development, and Quality/Reliability teams.
Requirements:
- Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
- Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.
- Solid understanding of problem-solving methodologies and root cause analysis.
- Familiarity with CMOS technology, DRAM architecture, and basic device physics.
- Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
- Strong attention to detail and commitment to quality.
- Ability to work effectively in team-based projects.
- Flexible, eager to learn, and capable of taking on diverse roles.
- Responsible, accountable, with a professional work ethic.
- Clear and effective written and spoken English skills.