Staff/Snr Microelectronic Engineer
Job Summary
The candidate will design and implement die attach and wirebond processes for NPI solutions in microwave/mmwave IC packaging. This role involves enhancing existing packaging processes to improve yield and productivity while collaborating with internal teams and suppliers. The engineer will serve as a subject matter expert, ensuring manufacturability and supporting product life cycles.
Responsibilities
- Design and implement die attach and wirebond processes for NPI.
- Supervise microelectronic assembly equipment setup and operation.
- Develop packaging solutions for aerospace and defense applications.
- Lead prototype building and pre-production assemblies.
- Support product life cycle and ensure quality standard compliance.
Required Skills
- 5-7 years of microelectronics assembly experience.
- Expertise in die-attach and wirebonding equipment.
- Proficiency in 2D/3D mechanical CAD software.
- Knowledge of JEDEC, ISO, and ASTM standards.
- Strong ability to interpret technical and assembly drawings.
Job Details
Job Description
1. Be the subject matter expert of the microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable.
2. Operate and supervise, including setup, die attachment and wirebonding equipment for all microelectronics assembly processes.
3. Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for customer products in aerospace and defense applications.
4. Responsible to define, develop and qualify new packages such as leadframe/substrate layout, bonding diagram, package outline drawing.
5. Develop assembly processes and establish process documentation that are stable, repeatable, and reliably meet design requirements.
6. Take a leading role in the build of prototypes, first articles, and pre-production assemblies.
7. Support customer products throughout their life cycle, developing and implementing changes as needed.
8. Consistently complete quality work in a timely manner meeting established deadlines.
9. Work with hybrid technology including RF ICs, capacitors, inductors, substrates, and other micro components.
10. Analyse and work to both prototype and released assembly drawings and process documents.
11. To ensure products manufactured in accordance with quality standards.
12. Train new personnel on all microelectronics assembly processes as required.
Requirements
1. Master/Degree/Diploma in electronic/mechatronic or any other engineering equivalent.
2. 5-7 years of related microelectronics assembly experience. Preferably in an engineering manufacturing environment where all processes were utilized. Significant work utilizing a microscope.
3. Good knowledge in microelectronics assembly workflow.
4. Knowledge and understanding of packaging design validation standards (ISO, ASTM, etc.), drafting and specification standards is essential.
5. Familiar with industrial electronic standards such as JEDEC a plus.
6. Knowledge and capacity to operate various microelectronics assembly equipment such as epoxy die-attach, eutectic solder attach, wirebonding, pull/shear testing, leak testing etc.
7. Ability to analyse and interpret technical drawings, assembly drawings and work instructions. Make recommendations for changes to improve build processes.
8. Proficient in assembly jig designs.
9. Familiar with industrial or consumer packaging trends.
10. Demonstrate proficiency in 2D/3D mechanical CAD software preferred.